Elume provides Anodic bonding processes
Glass to glass, as well as glass to Silicon.
Our primary customers are companies in the Life sciences, Biotech and Pharmaceutical
Combined with our sculpting (micro/nano channels) the wafers by either using our Micro blasting/ photo etching technology, plasma and or wet etching we can offer an integrated approach to develop your micro engineered devices.
We can also sit down with your company personnel to assist in finding the most practical as well as cost effective solution..
The mechanism involved in the bonding processes attributed to mobile ions in the glass.
At an elevated temperature the positive sodium ions in the glass have an increased mobility and are attracted to the negative electrode on the glass surface and are removed.
The resulting electric field between the surfaces pulls them into contact..
For good bonding a higher voltage is required if lower temperatures are used..
After the voltage is removed the structures are held together by a chemical bond.
This is an IRREVERSABLE bonding process. Therefore it becomes critical to have perfect alignment and particle free between the surfaces to be bonded.
Typical bonding parameters 450 degrees C at 1000 volts
Following is a simplified set up for anodic bonding.
Anodic Bonding - Glass To Glass Anodic Bonding - Glass To Silicon Anodic Bonding - Microfluidics Anodic Bonding