MSPB is a very low cost process to produce channels via’s interconnections etc. It is a parallel process as opposed to serial processing of one via at a time. Our process uses a photo sensitive tape laminated to the substrate; the tape is patterned using standard lithography. Only a single glass mask is used. The next process is to powder blast usually with ceramic or diamond powders in the micron ranges. The areas no longer covered by the film are etched while the covered area deflect the particles/powder typical finish ie roughness averages < 1 micron.
Pattern on the mask will be replicated on the wafer surface with absolute precision and NO post processing or polishing is needed, unlike other technologies i.e. laser drilling. Tape is now removed, and the wafer is ready for subsequent processes. As an example metalizing thin films of gold aluminum copper etc. Turn around processing time is rapid, less than one week for small quantities. Our technology can handle difficult materials to machine that are prone to breakage, chip, crack such as Glass, ceramics, sapphire Silicon carbide etc. MSBP is a dry, low stress, fast and very precise in the removal of defined material.
In short MSBP features
- Pattern creation channels via’s (holes)
- Large area material removal
- Marking parts
- Surface texturing /finishing/polishing
- Coating removal (thin films) without using strong toxic chemicals
- Creating /manipulating MEMS devices
- Micro fluidic (lab on) chip devices
MSBP is considered a non polluting green technology
For design tolerances products and application assistance etc, contact
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Via's in silicon wafer
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