Wafer Processes

• Micro-lithography 1 micron and up lines and spaces
• DC-RF sputtering
• Filament/source /Knudsen cell evaporation
• Short Runs (3-25 Wafers)
• Lift-off and back etch Processes
• Spin Coating
• Thermal, wet. dry oxidation 100 A- to 5 microns
• Vacuum annealing to 400 degreesC
• High temperature annealing to 1400 degrees C with nitrogen, oxygen, argon
• Melting glass into Silicon etched wafers
• KOH–HF- plasma etching
• Nitrides-Oxides deposition LPCVD or PVD
• Thin film metals, [see materials]
• Spin on diffusion dopants [contact ELume]
• Dicing scribing [contact ELume]
• Wafer thinning to 100 microns
• Plating up gold, nickel, copper, electroless, electroless lypic etc
• Metrology [see Quality Assurance]
• Die – wafer probing
• Wafer bonding Silicon, Glass [see Anodic Bonding]
• Organic semiconductor device evaluation in self contained Inert controlled load locked glove box with heating, vacuum and coating capabilities

Micro Engineered Devices

• Wafer processing and fabrication
• Fabrication of custom Multi Electrode interdigitated Arrays (MEIA)
• Fabrication of Glass based Micro engineered devices for biotek/pharma drug development
• Micro Mirror sensors and optical light modulators
• Thin film multi-layer RF Hybrids on Alumina
• Micron Sphere Powder Blasting Technology for VIA's and Channels
• R/D on PZT thin film energy harvesting devices
• R/D on multi junction thin film TC energy harvesting devices
• Alpha Silicon arrays sensors  for Titer Plates
• Organic conductive polymers for light emitting devices and solar cells on flex