Spin coating, polyimides, Cyclotenes, Teflon, spin-on glass, Sol-Gel precursors, etc. can replace and/or augment current mainstream technologies, including LPCVD, PECVD, CMP, vacuum deposition / sputtering, etc. Our MMF excels in this alternative process technology , using off-the-shelf materials or modifying/formulating them in-house where applicable.
Teflon AF ( K < 1.9 ) for RF, Microwave & Medical Devices Pos/Neg photo resists including SU-8/2000 epoxy types Pos/Neg tone photo-sensitive Polyimides ( 5000A > 250um ) Spin-on Glass (SOG) * Silk * BCB * Silicones * Electro-Optical UV Curable SiO2 * Low temperature Sol-Gel ( metals, oxides, transparent conductors -- ideal for nanotechnology ) Polymers for ( flexible ) Oled & other organic devices Dissolvable Wafers.
SCT is an attractive alternative deposition method. SCT processes use equipment that is much less expensive than competing high-energy-consuming CVD processes requiring special vacuum pumps, load locks, and expensive quartzware.
A single piece of our in-line SCT equipment is used to deposit and cure a wider variety of materials, inclusive of solgels, than a single CVD tool. The ability to deposit multiple materials and layers with the same mechanical hardware set allows for higher die yield at lower cost per finished wafer. One of our MMF built-in features is that we can eliminate batch processing altogether wherever practical, reducing the risk of misprocessing large numbers of wafers.
Spin coating is performed at room temperature (20-25°C), Sub-micron particles, in colloidal suspension are deposited using processing technique similar to photoresist. A pre-measured amount of the selected material is dispensed onto silicon, glass or similar type substrates. The final film thickness depends on the selected spining speed, time as well as the curing temperature.
During the spin cycle the liquid begins to vaporize leaving behind a semi-solid thin film. To cross link, solidify these films they undergo a series of hot plate bakes with a final cure in our quartz furnace at temperatures varying between 350-470°C. We convert these liquid organic and inorganic materials into dielectric films, conductor films (primarily aluminum, oxides) and more recently multi-layer semiconductor films. Fully cured materials are solid and stable between -200°C to > 200°C. Unlike mainstream (inorganic) materials, processed liquids are essentially pinhole free with virtually undetectable leakage currents (process sensitive). This fact alone greatly increases "chip" yield and therefore is worth considering.
Low-K values dramatically increase data processing speeds (by reducing the RC time constant) at the same time as minimizing parasitic capacitance between metal layers. Dielectric breakdown voltages approach 6x10(6) V/cm
Some other important features about Spin Coat Processing:
- Substantial decrease in processing costs per wafer
- Good adhesion to metal (material dependent)
- Important material in flat panel (micro) display manufacturing
- Excellent uniformity over large substrate area
- Un-matched process repeatibility
- Ultra-low particle defect density
- Easy of process adaptation to customer needs
- Lack of plasma damage
Note: CBC materials in addition are virtually non-hygroscopic.
- Spin on glass SOG 500 A to 2 microns
- Teflon AF 500 A to 3 microns
- BCB photoimagable 1000 to 20 mocrons
- Good for planarization
- Photoimagable Polyimide series 1 1000 A to 25 microns
- Series 2 25 – 150 microns
- SU 8 Series 1.0 to 100 microns
Spin Coating - Spin Coat Processing - SCT - Wafer Spin Coating - Semiconductor Spin Coating - Flat Panel Spin Coating