The following are current or recent projects that ELume has handled for its customers:

• Wet/dry oxidation (annealing) of Silicon Carbide between 900 to 1400 degrees centigrade
• MEIA (micro electrode interdigitated array) for life sciences research
• Silicon, glass, ceramic P(L)ZT foundry processing
• Polyimide (photoimagable) processing up to 150µ (cured) thickness for MEMS
• SOG (various) passivation, planarizing and interdielectric processes
• Multilayer metal dielectric
• Spin on Teflon AF for opto devices
• Flexible substrate processing, Kapton and high temp polyimides
• Micro fluid delivery systems (MEMS)
• High resolution movable micro-mirror and PZT substrates display devices
• Spatial light modulators (SLMs), resolution 128", 256", 512"
• Various biochip devices
• Implantable electrodes
• Planarizing using BCB (substitute for CMP)
• Test high voltage dielectric films for finger print recognition microchips (< V/B)
• MSPB channels in silicon and glass substrates
• Keyless touchscreen keyboard technology