Thin Films deposited using PVD, RF-DC Sputtering, Etching, and/or Evaporation

Materials processed in our Class 100 Facility

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Metals:

• Chromium
• Titanium
• AlSiCu
• Copper
• Nickel
• Palladium
• Gold
• Silver
• Molybdenum
• Platinum
• Rhodium
• Indium
• Tin
• Germanium
• Tungsten
• Ruthenium Oxide (for P(L)ZT electrodes)
• LSCO (for P(L)ZT electrodes)
• Aluminum (also fusable for displays)

1. Various compounds/oxides of the above including tri-metal
2. ELume can up-plate as needed to 10micron
3. Special precautions are taken with Au, Cu, platinum and others so as not to cross-contaminate the surface of these materials

Dielectrics:

• Silicon Dioxide - SiO 2
• Aluminum Oxide - Al 2 O 3
• Tantalum Pentoxide - Ta 2 O 5
• Silicon Nitride - SiN 3
• Titanium Oxide - TiO 2
• Germanium Oxide - GeO 2
• Zirconium Oxide - ZrO 2
• Yttrium Oxide - Y 2 O 3
• Barium Titanate (Hi Q capacitors)
• Others

Transparent Conductors:

• Indium-tin-oxide (ITO)